Holds optimally designed facility for Tyvek® cutting

• Minimize fabric particles by using Ring Knife that can be adjusted precisely
• Remove particles generated in the Cutting Part through localized discharge device
• Execute facility management for each Hard/Soft Type

Facility optimized for effective removal of foreign matters and particles that
generate on the Tyvek® surface

• Prevent the phenomenon of adhesion of foreign matters due to static electricity
  through the use of Ionizer
• Apply format optimized for removal of foreign matters from Tyvek® and Film
• Remove the possibility of occurrence of particles due to damages in the fabric in
  non-contact format

Facility appropriate for Tyvek® Sealing conditions presented by Dupont™

• Can adjust individual factors of Tyvek® binding including temperature, time and
  pressure, etc
• Can cope with the sizes and designs appropriate for the requests of the clients
• Process optimized for maintenance of outstanding binding strength

Facility that complies with the Tyvek® Sealing conditions presented by Dupont™

• Comply with needle and sewing conditions appropriate for Tyvek®
• Minimize product particle through application of localized discharge device

Vacuum packaging facility for prevention of mixing in of particles

• Optimized for particle and foreign matter management by using LDPE Film
  manufactured in clean room
• Provide packaging specifications in accordance with the issues requested by the clients